ZHCSOY4B september 2021 – june 2023 LMK1D2102 , LMK1D2104
PRODUCTION DATA
| THERMAL METRIC (1) | LMK1D2102 | LMK1D2104 | UNIT | |
|---|---|---|---|---|
| VQFN | VQFN | |||
| 16 PINS | 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 48.7 | 38.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.4 | 32.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 23.6 | 18.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.6 | 1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 23.6 | 18.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 8.6 | 8.2 | °C/W |