ZHCSP13A september 2021 – june 2023 LMK1D1204P
PRODUCTION DATA
| THERMAL METRIC(1) | LMK1D1204P | UNIT | |
|---|---|---|---|
| RHD (VQFN) | |||
| 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 38.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 32.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 18.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 18.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 8.2 | °C/W |