ZHCSLH1A September 2021 – December 2021 LMH5485-SP
ADVANCE INFORMATION
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMH5485-SP | UNIT | |
|---|---|---|---|
| HKX (CFP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 145.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 128.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 61.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 122.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 55.8 | °C/W |