ZHCSH62B December 2017 – October 2019 LM76002-Q1 , LM76003-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | LM76002/LM76003 | UNIT | |
|---|---|---|---|
| RNP (WQFN) | |||
| 30 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 29.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 17.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 9.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.0 | °C/W |