ZHCSLG2B September 2021 – August 2022 LM74722-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM74722-Q1 | UNIT | |
|---|---|---|---|
| DRR (WSON) | |||
| 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 61.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 32.7 | °C/W |
| RθJC | Junction-to-case (botton) thermal resistance | 6.9 | °C/W |