ZHCSSM5D May 1999 – February 2024 LM7171
PRODUCTION DATA
| THERMAL METRIC(1) | LM7171 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) A Version | D (SOIC) B Version | P (PDIP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 122.5 | 172 | 108 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 64.7 | 62.4 | 52.4 | ℃/W |
| RθJB | Junction-to-board thermal resistance | 65.9 | 55.7 | 51.9 | ℃/W |
| ΨJT | Junction-to-top characterization parameter | 17.6 | 16.5 | 6.8 | ℃/W |
| ΨJB | Junction-to-board characterization parameter | 65.1 | 55.1 | 51.1 | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | ℃/W |