ZHCSN39A February 2020 – November 2021 LM61480 , LM61495 , LM62460
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Output Voltage Selection
- 8.3.2 Enable EN Pin and Use as VIN UVLO
- 8.3.3 SYNC/MODE Uses for Synchronization
- 8.3.4 Clock Locking
- 8.3.5 Adjustable Switching Frequency
- 8.3.6 RESET Output Operation
- 8.3.7 Internal LDO, VCC UVLO, and BIAS Input
- 8.3.8 Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
- 8.3.9 Adjustable SW Node Slew Rate
- 8.3.10 Spread Spectrum
- 8.3.11 Soft Start and Recovery From Dropout
- 8.3.12 Overcurrent and Short Circuit Protection
- 8.3.13 Hiccup
- 8.3.14 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Choosing the Switching Frequency
- 9.2.2.2 Setting the Output Voltage
- 9.2.2.3 Inductor Selection
- 9.2.2.4 Output Capacitor Selection
- 9.2.2.5 Input Capacitor Selection
- 9.2.2.6 BOOT Capacitor
- 9.2.2.7 BOOT Resistor
- 9.2.2.8 VCC
- 9.2.2.9 CFF and RFF Selection
- 9.2.2.10 RSPSP Selection
- 9.2.2.11 RT Selection
- 9.2.2.12 RMODE Selection
- 9.2.2.13 External UVLO
- 9.2.2.14 Maximum Ambient Temperature
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RPH|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RPH|16
訂購(gòu)信息
12.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |