ZHCSCJ2 June 2014 LM3633
PRODUCTION DATA.

| PIN | DESCRIPTION | |
|---|---|---|
| NAME | NUMBER | |
| C− | A1 | Integrated charge pump flying capacitor negative pin. Connect a 1-µF ceramic capacitor between C+ and C−. |
| C+ | A2 | Integrated charge pump flying capacitor positive pin. Connect a 1-µF ceramic capacitor between C+ and C−. |
| CPOUT | A3 | Integrated charge pump output pin. Bypass CPOUT to GND with a 1-µF ceramic capacitor. |
| IN | A4 | Input voltage connection. Bypass IN to GND with a minimum 2.2-µF ceramic capacitor. |
| HVLED1 | B1 | Input pin to high-voltage current sink 1 (40 V max). The boost converter regulates the minimum of HVLED1, HVLED2 and HVLED3 to VHR. |
| SDA | B2 | Serial data connection for I2C-Compatible Interface. |
| OVP | B3 | Overvoltage sense input. Connect OVP to the positive pin of the inductive boost output capacitor (COUT). |
| GND | B4 | Ground |
| HVLED2 | C1 | Input pin to high-voltage current sink 2 (40 V max). The boost converter regulates the minimum of HVLED1, HVLED2 and HVLED3 to VHR. |
| SCL | C2 | Serial clock connection for I2C-Compatible Interface. |
| PWM | C3 | PWM brightness control input for CABC operation. PWM is a high-impedance input and cannot be left floating. |
| SW | C4 | Drain connection for the internal NFET. Connect SW to the junction of the inductor and the Schottky diode anode. |
| HVLED3 | D1 | Input pin to high-voltage current sink 3 (40 V max). The boost converter regulates the minimum of HVLED1, HVLED2 and HVLED3 to VHR. |
| HWEN | D2 | Hardware enable input. Drive this pin high to enable the device. Drive this pin low to force the device into a low power shutdown. HWEN is a high-impedance input and cannot be left floating. |
| LVLED6 | D3 | Low-voltage current sink 6 |
| LVLED5 | D4 | Low-voltage current sink 5 |
| LVLED1 | E1 | Low-voltage current sink 1 |
| LVLED2 | E2 | Low-voltage current sink 2 |
| LVLED3 | E3 | Low-voltage current sink 3 |
| LVLED4 | E4 | Low-voltage current sink 4 |