ZHCSDO1 May 2015 LM2775
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- DSG|8
訂購信息
5 Pin Configuration and Functions
DSG Package
8-Pin WSON with Thermal Pad
Top View
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | PFM | I | PFM mode enable. Allow or disallow PFM operation. 1 = PFM enabled, 0 = PWM disabled |
| 2 | C1– | P | Flying capacitor pin |
| 3 | C1+ | P | Flying capacitor pin |
| 4 | OUTDIS | I | Output disconnect option. 1 = Active output discharge during shutdown, 0 = High impedance output without pull-down during shutdown. |
| 5 | EN | I | Chip enable. 1 = Enabled, 0 = Disabled |
| 6 | VOUT | O | Charge pump output |
| 7 | VIN | P | Input voltage |
| 8 | GND | G | Ground |
| Thermal Pad | GND | GND | Connect to GND |