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SNOS965J June 2001 – December 2015 LM2611

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

DBV|5
- MPDS018T

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Input voltage, V_IN		14.5	V
SW voltage	–0.4	36	V
NFB voltage	–6	0.4	V
SHDN voltage	–0.4	14.5	V
Maximum junction temperature		125	°C
Power dissipation ⁽²⁾	Internally limited
Lead temperature		300	°C
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The maximum allowable power dissipation is a function of the maximum junction temperature, T_J_(MAX), the junction-to-ambient thermal resistance, θ_JA, and the ambient temperature, T_A. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation at any ambient temperature is calculated using: P_D (MAX) = (T_J(MAX) − T_A)/θ_JA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾	±2000	V
V_(ESD)	Electrostatic discharge	Machine Model (MM)⁽³⁾	±200	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

(3) The machine model is a 200-pF capacitor discharged directly into each pin.

6.3 Recommended Operating Conditions

	MIN	NOM	MAX	UNIT
Supply voltage	2.7		14	V
Operating junction temperature, T_J	−40		125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM2611	UNIT
		DBV (SOT-23)
		5 PINS
R_θJA	Junction-to-ambient thermal resistance	163.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	115.2	°C/W
R_θJB	Junction-to-board thermal resistance	27.4	°C/W
ψ_JT	Junction-to-top characterization parameter	12.9	°C/W
ψ_JB	Junction-to-board characterization parameter	26.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Specifications in standard type face are for T_J = 25°C, unless otherwise specified. V_IN = 5 V and I_L = 0 A, unless otherwise specified.

PARAMETER		TEST CONDITIONS	MIN ⁽¹⁾	TYP ⁽²⁾	MAX ⁽¹⁾	UNIT
V_IN	Input voltage	T_J = −40°C to +85°C	2.7		14	V
I_SW	Switch current limit	Grade A		1.2		A
		Grade A; T_J = −40°C to +85°C	1		2
		Grade B		0.9
		Grade B; T_J = −40°C to +85°C	0.7
R_DSON	Switch ON resistance	Grade A		0.5	0.65	Ω
R_DSON	Switch ON resistance	Grade B		0.7	0.9	Ω
SHDN_TH	Shutdown threshold	Device enabled; T_J = −40°C to +85°C	1.5			V
SHDN_TH	Shutdown threshold	Device disabled; T_J = −40°C to +85°C			0.5	V
I_SHDN	Shutdown pin bias current	V_SHDN = 0 V		0		µA
		V_SHDN = 5 V		0
		V_SHDN = 5 V; T_J = −40°C to +85°C			1
NFB	Negative feedback reference	V_IN = 3 V		−1.23		V
NFB	Negative feedback reference	V_IN = 3 V; T_J = −40°C to +85°C	−1.205		−1.255	V
I_NFB	NFB pin bias current	V_NFB =−1.23 V		−4.7		µA
I_NFB	NFB pin bias current	V_NFB =−1.23 V; T_J = −40°C to +85°C	−2.7		−6.7	µA
I_q	Quiescent current	V_SHDN = 5 V, Switching		1.8		mA
		V_SHDN = 5 V, Switching; T_J = −40°C to +85°C			3.5	mA
		V_SHDN = 5 V, Not Switching		270		µA
		V_SHDN = 5 V, Not Switching; T_J = −40°C to +85°C			500	µA
		V_SHDN = 0 V		0.024		µA
		V_SHDN = 0 V; T_J = −40°C to +85°C			1	µA
%V_OUT/ ΔV_IN	Reference line regulation	2.7 V ≤ V_IN ≤ 14 V		0.02		%/V
f_S	Switching frequency	T_J = 25°C		1.4		MHz
f_S	Switching frequency	T_J = −40°C to +85°C	1		1.8	MHz
D_MAX	Maximum duty cycle	T_J = 25°C		88%
D_MAX	Maximum duty cycle	T_J = −40°C to +85°C	82%
I_L	Switch leakage	V_SW = 5 V, Not Switching			1	µA

(1) All limits are specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% tested through statistical analysis. All limits at temperature extremes via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

(2) Typical numbers are at 25°C and represent the expected value of the parameter.