ZHCS536O September 2008 – August 2015 LM22677 , LM22677-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Applications and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- NDR|7
- |
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN to GND | 43 | V | ||
| EN Pin Voltage | –0.5 | 6 | V | |
| RT/SYNC Pin Voltage | –0.5 | 7 | V | |
| SW to GND(3) | –5 | VIN | V | |
| BOOT Pin Voltage | VSW + 7 | V | ||
| FB Pin Voltage | –0.5 | 7 | V | |
| Power Dissipation | Internally Limited | |||
| Junction Temperature | 150 | °C | ||
| For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549). | ||||
| Storage temperature, Tstg | –65 | 150 | °C | |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the absolute maximum ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The absolute-maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns.
6.2 ESD Ratings: LM22677
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings: LM22677-Q1
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN | Supply Voltage | 4.5 | 42 | V |
| Junction Temperature | –40 | 125 | °C | |
6.5 Thermal Information
| THERMAL METRIC(1)(2) | LM22677 | UNIT | |
|---|---|---|---|
| NDR (TO-263) | |||
| 7 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 22 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The value of RθJA for the NDR (TJ) package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 20 to 30°C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN Package (SNVA328) for more information.
6.6 Electrical Characteristics
Typical values represent the most likely parametric norm at TA = TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified: VIN = 12 V.| PARAMETER | TEST CONDITIONS | MIN(1) | TYP(2) | MAX(1) | UNIT | |
|---|---|---|---|---|---|---|
| LM22677-5.0 | ||||||
| VFB | Feedback Voltage | VIN = 8 V to 42 V | 4.925 | 5.0 | 5.075 | V |
| VIN = 8 V to 42 V, –40°C ≤ TJ ≤ 125°C | 4.9 | 5.1 | ||||
| LM22677-ADJ | ||||||
| VFB | Feedback Voltage | VIN = 4.7 V to 42 V | 1.266 | 1.285 | 1.304 | V |
| VIN = 4.7 V to 42 V, –40°C ≤ TJ ≤ 125°C | 1.259 | 1.311 | ||||
| ALL OUTPUT VOLTAGE VERSIONS | ||||||
| IQ | Quiescent Current | VFB = 5 V | 3.4 | mA | ||
| VFB = 5 V, –40°C ≤ TJ ≤ 125°C | 6 | |||||
| ISTDBY | Standby Quiescent Current | EN Pin = 0 V | 25 | 40 | µA | |
| ICL | Current Limit | 6.0 | 7.1 | 8.4 | A | |
| –40°C ≤ TJ ≤ 125°C | 5.75 | 8.75 | ||||
| IL | Output Leakage Current | VIN = 42 V, EN Pin = 0 V, VSW = 0 V | 0.2 | 2 | µA | |
| VSW = –1 V | 0.1 | 3 | µA | |||
| RDS(ON) | Switch On-Resistance | 0.1 | 0.14 | Ω | ||
| –40°C ≤ TJ ≤ 125°C | 0.2 | |||||
| fO | Oscillator Frequency | 500 | kHz | |||
| –40°C ≤ TJ ≤ 125°C | 400 | 600 | ||||
| TOFFMIN | Minimum Off-time | 200 | ns | |||
| –40°C ≤ TJ ≤ 125°C | 100 | 300 | ||||
| TONMIN | Minimum On-time | 100 | ns | |||
| IBIAS | Feedback Bias Current | VFB = 1.3 V (ADJ Version Only) | 230 | nA | ||
| VEN | Enable Threshold Voltage | Falling | 1.6 | V | ||
| Falling, –40°C ≤ TJ ≤ 125°C | 1.3 | 1.9 | ||||
| VENHYST | Enable Voltage Hysteresis | 0.6 | V | |||
| IEN | Enable Input Current | EN Input = 0 V | 6 | µA | ||
| FSYNC | Maximum Synchronization Frequency | VSYNC = 3.5 V, 50% duty-cycle | 1 | MHz | ||
| VSYNC | Synchronization Threshold Voltage | 1.75 | V | |||
| TSD | Thermal Shutdown Threshold | 150 | °C | |||
(1) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
(2) Typical values represent most likely parametric norms at the conditions specified and are not ensured.
6.7 Typical Characteristics
VIN = 12 V, TJ = 25°C (unless otherwise specified).
Figure 1. Efficiency vs IOUT and VIN, VOUT = 3.3 V
Figure 3. Current Limit vs Temperature
Figure 5. Feedback Bias Current vs Temperature
Figure 7. Standby Quiescent Current vs Input Voltage
Figure 9. Normalized Feedback Voltage vs Input Voltage
Figure 2. Normalized Switching Frequency vs Temperature
Figure 4. Normalized RDS(ON) vs Temperature
Figure 6. Normalized Enable Threshold Voltage vs Temperature
Figure 8. Normalized Feedback Voltage vs Temperature
Figure 10. Switching Frequency vs RT/SYNC Resistor