ZHCSLW8C august 2021 – may 2023 ISO6760-Q1 , ISO6761-Q1 , ISO6762-Q1 , ISO6763-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | ISO676x | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 68.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 32.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |