ZHCSE44C august 2015 – may 2023 ISO5852S
PRODUCTION DATA
| THERMAL METRIC(1) | ISO5852S | UNIT | |
|---|---|---|---|
| DWW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 99.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 48.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 29.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.5 | °C/W |