4 修訂歷史記錄
Changes from D Revision (July 2016) to E Revision
- Changed 將 16 引腳 SOIC 封裝更改為 16 引腳 PDIP 封裝，以便與數(shù)據(jù)表最后的封裝選項(xiàng)附錄中顯示的產(chǎn)品相匹配Go
- Changed DVA and NVF pin configuration labels to match content shown in the package option addendum at the end of the data sheetGo
- Changed parameter name from "vs temperature" to "Input offset drift" in Electrical Characteristics tableGo
- Changed parameter name from "vs power supply" to "Power-supply rejection ratio" in Electrical Characteristics tableGo
- Changed location of supply voltage specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
- Changed parameter name from "Quiescent current" to "High-side analog supply current", and changed symbol from "VS1" to "IVS1" in Electrical Characteristics tableGo
- Changed parameter name from "Quiescent current" to "Low-side analog supply current", and changed symbol from "VS2" to "IVS2" in Electrical Characteristics tableGo
- Changed location of Temperature specifications from the Electrical Characteristics table to the Recommended Operating Conditions tableGo
- Deleted Thermal resistance parameters from Electrical Characteristics table; see Thermal Information tableGo
Changes from C Revision (September 2005) to D Revision
- Added 增加了 ESD 額定值表、特性 說(shuō)明 部分、器件功能模式、應(yīng)用和實(shí)施 部分、電源建議 部分、布局 部分、器件和文檔支持 部分以及機(jī)械、封裝和可訂購(gòu)信息 部分。Go