ZHCSBL2C December 2016 – January 2021 HD3SS213
PRODUCTION DATA
| THERMAL METRIC | HD3SS213 | UNIT | |
|---|---|---|---|
| nFBGA (ZXH) | |||
| 50 PIN | |||
| RθJA | Junction-to-ambient thermal resistance | 72.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 35.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |