ZHCSV52 March 2024 ESDS452
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | ESDS452 | UNIT | |
|---|---|---|---|
| DBZ (SOT-23) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 309.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 162.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 149.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 41.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 147.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |