ZHCSJA9B September 2005 – January 2019 DS90LV028AH
PRODUCTION DATA.
| THERMAL METRIC(1) | DS90LV028AH | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 119.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 59.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 62.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 61.6 | °C/W |