ZHCSKG2B September 2016 – October 2019 DS280BR820
PRODUCTION DATA.
| THERMAL METRIC (1) | CONDITIONS / ASSUMPTIONS | VALUE | UNIT | |
|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance | 4-layer JEDEC board | 45.2 | °C/W |
| 10-layer 8-in x 6-in board | 26.3 | |||
| 20-layer 8-in x 6-in board | 24.8 | |||
| 30-layer 8-in x 6-in board | 22.7 | |||
| RθJC(top) | Junction-to-case (top) thermal resistance | 4-layer JEDEC board | 26.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 4-layer JEDEC board | 25.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 4-layer JEDEC board | 13.3 | °C/W |
| 10-layer 8-in x 6-in board | 13.0 | |||
| 20-layer 8-in x 6-in board | 13.0 | |||
| 30-layer 8-in x 6-in board | 13.0 | |||
| ψJB | Junction-to-board characterization parameter | 4-layer JEDEC board | 22.8 | °C/W |
| 10-layer 8-in x 6-in board | 21.4 | |||
| 20-layer 8-in x 6-in board | 21.1 | |||
| 30-layer 8-in x 6-in board | 20.8 | |||