ZHCSRO2 February   2023 DS160PR1601

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD and Latchup Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 DC Electrical Characteristics
   6. 6.6 High Speed Electrical Characteristics
   7. 6.7 SMBUS/I2C Timing Charateristics
   8. 6.8 Typical Characteristics
   9. 6.9 Typical Jitter Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Control and Configuration Interface
      1. 7.3.1 Pin Configurations for Lanes
         1. 7.3.1.1 Five-Level Control Inputs
      2. 7.3.2 SMBUS/I2C Register Control Interface
      3. 7.3.3 SMBus/I 2 C Primary Mode Configuration (EEPROM Self Load)
   4. 7.4 Feature Description
      1. 7.4.1 Linear Equalization
      2. 7.4.2 Flat-Gain
      3. 7.4.3 Analog EyeScan
      4. 7.4.4 Receiver Detect State Machine
      5. 7.4.5 Integrated Capacitors
   5. 7.5 Device Functional Modes
      1. 7.5.1 Active PCIe Mode
      2. 7.5.2 Active Buffer Mode
      3. 7.5.3 Standby Mode
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Applications
      1. 8.2.1 PCIe x16 Lane Configuration
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
         3. 8.2.1.3 Application Curves
   3. 8.3 Power Supply Recommendations
   4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
9. 9 Device and Documentation Support
   1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
   2. 9.2 接收文檔更新通知
   3. 9.3 支持資源
   4. 9.4 Trademarks
   5. 9.5 靜電放電警告
   6. 9.6 術(shù)語(yǔ)表
10. 10Mechanical, Packaging, and Orderable Information