ZHCS343C May 2012 – January 2023 DRV2665
PRODUCTION DATA
| THERMAL METRIC(1) | DRV2665 | UNIT | |
|---|---|---|---|
| RGP (QFN) | |||
| 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 32.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 30.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.2 | °C/W |