ZHCSFA9A June 2016 – July 2016 DRV2511-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DAP|32
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DAP|32
訂購(gòu)信息
10 Layout
10.1 Layout Guidelines
The EVM layout optimizes for thermal dissipation and EMC performance. The DRV2511-Q1 device has a thermal pad down, and good thermal conduction and dissipation require adequate copper area. Layout also affects EMC performance. It is best practice to use the same/similiar layout as shown below in the DRV2511Q1EVM.
10.2 Layout Example
Figure 11. DRV2511-Q1 EVM