ZHCSXX4D December 2004 – April 2025 CD74HC4067-Q1 , CD74HCT4067-Q1
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Figure 4-1 DW Package, 24-Pin SOIC
(Top View)| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| COMMON INPUT/OUTPUT | 1 | IO | Common input or output. |
| I7 | 2 | IO | Switch input/output |
| I6 | 3 | IO | Switch input/output |
| I5 | 4 | IO | Switch input/output |
| I4 | 5 | IO | Switch input/output |
| I3 | 6 | IO | Switch input/output |
| I2 | 7 | IO | Switch input/output |
| I1 | 8 | IO | Switch input/output |
| I0 | 9 | IO | Switch input/output |
| S0 | 10 | I | Select/Address pin |
| S1 | 11 | I | Select/Address pin |
| GND | 12 | P | Ground pin |
| S3 | 13 | I | Select/Address pin |
| S2 | 14 | I | Select/Address pin |
| E | 15 | I | Enable for all switches ON/OFF |
| I15 | 16 | IO | Switch input/output |
| I14 | 17 | IO | Switch input/output |
| I13 | 18 | IO | Switch input/output |
| I12 | 19 | IO | Switch input/output |
| I11 | 20 | IO | Switch input/output |
| I10 | 21 | IO | Switch input/output |
| I9 | 22 | IO | Switch input/output |
| I8 | 23 | IO | Switch input/output |
| VCC | 24 | P | Power pin |
| Thermal Pad | - | The thermal pad is not electrically connected and can be floated, grounded or tied to VCC | |