ZHCSO58D August 1997 – May 2021 CD54HC20 , CD74HC20
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | CD74HC20 | UNIT | ||
|---|---|---|---|---|
| N (PDIP) | D (SOIC) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 66.2 | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 53.9 | 89.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 45.9 | 89.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 33.5 | 45.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 45.7 | 89.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |