ZHCSQA3F November 1997 – March 2022 CD54HC4094 , CD74HC4094 , CD74HCT4094
PRODUCTION DATA
- 1 特性
- 2 說明
- 3 Revision History
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Power Supply Recommendations
- 9 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- J|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
2 說明
CDx4HC4094 和 CD74HCT4094 是 8 級串行移位寄存器，具有一個與每一級關(guān)聯(lián)的鎖存器，可將數(shù)據(jù)從串行輸入選通到并行緩沖三態(tài)輸出?？蓪⒉⑿休敵鲋苯舆B接到公共總線。數(shù)據(jù)在正時鐘轉(zhuǎn)換時發(fā)生移位。當(dāng)選通輸入為高電平時，每個移位寄存器級的數(shù)據(jù)都會傳輸?shù)酱鎯拇嫫髦小．?dāng)輸出使能信號為高電平時，存儲寄存器中的數(shù)據(jù)會傳輸?shù)捷敵龆恕?/p>
器件信息
| 器件型號 | 封裝(1) | 封裝尺寸（標(biāo)稱值） |
|---|---|---|
| CD54HC4094F3A | CDIP (16) | 24.38mm × 6.92mm |
| CD74HC4094M | SOIC (16) | 9.90mm × 3.90mm |
| CD74HC4094E | PDIP (16) | 19.31mm × 6.35mm |
| CD74HC4094NSR | SO (16) | 6.20mm × 5.30mm |
| CD74HC4094PW | TSSOP (16) | 5.00mm × 4.40mm |
| CD74HCT4094M | SOIC (16) | 9.90mm × 3.90mm |
| CD74HCT4094E | PDIP (16) | 19.31mm × 6.35mm |
(1) 如需了解所有可用封裝，請參閱數(shù)據(jù)表末尾的可訂購產(chǎn)品附錄。
功能框圖