SLUSFF9 November 2023 BQ27Z558
PRODUCTION DATA
| THERMAL METRIC(1) | BQ27Z558 | UNIT | |
|---|---|---|---|
| DSBGA (YPH) | |||
| (12 PINS) | |||
| RθJA | Junction-to-ambient thermal resistance | 64.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 59.8 | |
| RθJB | Junction-to-board thermal resistance | 52.7 | |
| ψJT | Junction-to-top characterization parameter | 0.3 | |
| ψJB | Junction-to-board characterization parameter | 28.3 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.4 | |