ZHCSDI4D March 2015 – October 2022 BQ25890 , BQ25892
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25890 BQ25892 | UNIT | |
|---|---|---|---|
| RTW (WQFN) | |||
| 24-PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.8 | °C/W |
| RθJC((op) | Junction-to-case (top) thermal resistance | 27.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.0 | °C/W |