ZHCSJZ6F June 2019 – February 2025 BQ25618 , BQ25619
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25619 | UNIT | |
|---|---|---|---|
| RTW (WQFN) | |||
| 24 Pins | |||
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 35.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 11.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 12 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.6 | °C/W |