ZHCSK78A september 2019 – august 2023 BQ21061
PRODUCTION DATA
| THERMAL METRIC(1) | BQ21061 | UNIT | |
|---|---|---|---|
| YFP (DSBGA) | |||
| 20-PIN | |||
| RθJA | Junction-to-ambient thermal resistance (2) | 36.1 | °C/W |
| RθJA | Junction-to-ambient thermal resistance | 74.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 17.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 17.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |