ZHCSHK2C August 2019 – May 2025 AMC3301
PRODUCTION DATA
| THERMAL METRIC(1) | AMC3301 | UNIT | |
|---|---|---|---|
| DWE (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 73.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 31 | °C/W |
| RθJB | Junction-to-board thermal resistance | 44 | °C/W |
| ψJT | Junction-to-top characterization parameter | 16.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |