ZHCSFZ3 February 2017 AMC1305L25-Q1 , AMC1305M05-Q1 , AMC1305M25-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Ratings
- 7.6 Insulation Specifications
- 7.7 Safety-Related Certifications
- 7.8 Safety Limiting Values
- 7.9 Electrical Characteristics: AMC1305M05-Q1
- 7.10 Electrical Characteristics: AMC1305x25-Q1
- 7.11 Switching Characteristics
- 7.12 Insulation Characteristics Curves
- 7.13 Typical Characteristics
- 8 Detailed Description
- 9 Application and Implementation
- 10Power-Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
訂購(gòu)信息
11 Layout
11.1 Layout Guidelines
A layout recommendation showing the critical placement of the decoupling capacitors (as close as possible to the AMC1305-Q1) and placement of the other components required by the device is shown in Figure 59.
For the AMC1305L25-Q1 version, place the 100-Ω termination resistor as close as possible to the CLKIN, CLKIN_N inputs of the device to achieve highest signal integrity. If not integrated, an additional termination resistor is required as close as possible to the LVDS data inputs of the MCU or filter device; see Figure 60.
11.2 Layout Examples
Figure 59. Recommended Layout of the AMC1305Mx-Q1
Figure 60. Recommended Layout of the AMC1305L25-Q1