ZHCSFZ3 February 2017 AMC1305L25-Q1 , AMC1305M05-Q1 , AMC1305M25-Q1
PRODUCTION DATA.
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage, AVDD to AGND or DVDD to DGND | –0.3 | 6.5 | V | |
| Analog input voltage at AINP, AINN | AGND – 6 | AVDD + 0.5 | V | |
| Digital input voltage at CLKIN, CLKIN_N | DGND – 0.3 | DVDD + 0.3 | V | |
| Input current to any pin except supply pins | –10 | 10 | mA | |
| Maximum virtual junction temperature, TJ | 150 | °C | ||
| Storage temperature, Tstg | –65 | 150 | °C | |
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002(1) | ±2500 | V |
| Charged device model (CDM), per AEC Q100-011 | ±1000 | |||
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| AVDD | High-side (analog) supply voltage | 4.5 | 5.0 | 5.5 | V |
| DVDD | Controller-side (digital) supply voltage | 3.0 | 3.3 | 5.5 | V |
| TA | Operating ambient temperature range | –40 | 125 | °C | |
| THERMAL METRIC(1) | AMC1305x-Q1 | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 80.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 40.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 45.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 44.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |
| PARAMETER | TEST CONDITIONS | VALUE | UNIT | |
|---|---|---|---|---|
| PD | Maximum power dissipation (both sides) | AVDD = 5.5 V, DVDD = 5.5 V, LVDS, RLOAD = 100 Ω | 89.1 | mW |
| PD1 | Maximum power dissipation (high-side supply) | AVDD = 5.5 V | 45.1 | mW |
| PD2 | Maximum power dissipation (low-side supply) | DVDD = 5.5 V, LVDS, RLOAD = 100 Ω | 44 | mW |
| PARAMETER | TEST CONDITIONS | VALUE | UNIT | |
|---|---|---|---|---|
| GENERAL | ||||
| CLR | Minimum air gap (clearance)(1) | Shortest pin-to-pin distance through air | ≥ 8 | mm |
| CPG | Minimum external tracking (creepage)(1) | Shortest pin-to-pin distance across the package surface | ≥ 8 | mm |
| DTI | Distance through insulation | Minimum internal gap (internal clearance) of the double insulation (2 × 0.0135 mm) | 0.027 | mm |
| CTI | Comparative tracking index | DIN EN 60112 (VDE 0303-11); IEC 60112 | ≥ 600 | V |
| Material group | According to IEC 60664-1 | I | ||
| Overvoltage category per IEC 60664-1 | Rated mains voltage ≤ 300 VRMS | I-IV | ||
| Rated mains voltage ≤ 600 VRMS | I-III | |||
| Rated mains voltage ≤ 1000 VRMS | I-II | |||
| DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12(2) | ||||
| VIORM | Maximum repetitive peak isolation voltage | At ac voltage (bipolar or unipolar) | 1414 | VPK |
| VIOWM | Maximum-rated isolation working voltage | At ac voltage (sine wave) | 1000 | VRMS |
| At dc voltage | 1500 | VDC | ||
| VIOTM | Maximum transient isolation voltage | VTEST = VIOTM, t = 60 s (qualification test) | 7000 | VPK |
| VTEST = 1.2 x VIOTM, t = 1 s (100% production test) | 8400 | |||
| VIOSM | Maximum surge isolation voltage(3) | Test method per IEC 60065, 1.2/50-μs waveform, VTEST = 1.6 x VIOSM = 10000 VPK (qualification) | 6250 | VPK |
| qpd | Apparent charge(4) | Method a, after input/output safety test subgroup 2 / 3, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.2 x VIORM = 1697 VPK, tm = 10 s | ≤ 5 | pC |
| Method a, after environmental tests subgroup 1, Vini = VIOTM, tini = 60 s, Vpd(m) = 1.6 x VIORM = 2263 VPK, tm = 10 s | ≤ 5 | pC | ||
| Method b1, at routine test (100% production) and preconditioning (type test), Vini = VIOTM, tini = 1 s, Vpd(m) = 1.875 x VIORM = 2652 VPK, tm = 1 s | ≤ 5 | pC | ||
| CIO | Barrier capacitance, input to output(5) | VIO = 0.5 VPP at 1 MHz | 1.2 | pF |
| RIO | Insulation resistance, input to output(5) | VIO = 500 V at TS = 150°C | > 109 | Ω |
| Pollution degree | 2 | |||
| Climatic category | 40/125/21 | |||
| UL1577 | ||||
| VISO | Withstand isolation voltage | VTEST = VISO = 5000 VRMS or 7000 VDC, t = 60 s (qualification test), VTEST = 1.2 x VISO = 6000 VRMS, t = 1 s (100% production test) | 5000 | VRMS |
| VDE | UL | ||
|---|---|---|---|
| Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12, DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08, and DIN EN 60095 (VDE 0860): 2005-11 | Recognized under UL1577 component recognition and CSA component acceptance NO 5 programs | ||
| Reinforced insulation | Single protection | ||
| File number: 40040142 | File number: E181974 |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| IS | Safety input, output, or supply current | θJA = 80.2°C/W, AVDD = DVDD = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 3 | 283 | mA | ||
| θJA = 80.2°C/W, AVDD = DVDD = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 3 | 432 | mA | ||||
| PS | Safety input, output, or total power | θJA = 80.2°C/W, TJ = 150°C, TA = 25°C, see Figure 4 | 1558(1) | mW | ||
| TS | Maximum safety temperature | 150 | °C | |||
The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| ANALOG INPUTS | ||||||
| VClipping | Maximum differential voltage input range (AINP-AINN) |
±62.5 | mV | |||
| FSR | Specified linear full-scale range (AINP-AINN) |
–50 | 50 | mV | ||
| VCM | Operating common-mode input range | –0.032 | AVDD – 2 | V | ||
| CID | Differential input capacitance | 2 | pF | |||
| IIB | Input current | Inputs shorted to AGND | –97 | –72 | -57 | μA |
| RID | Differential input resistance | 5 | kΩ | |||
| IOS | Input offset current | ±5 | nA | |||
| CMTI | Common-mode transient immunity | 15 | kV/μs | |||
| CMRR | Common-mode rejection ratio | fIN = 0 Hz, VCM min ≤ VIN ≤ VCM max |
–104 | dB | ||
| fIN from 0.1 Hz to 50 kHz, VCM min ≤ VIN ≤ VCM max |
–75 | |||||
| BW | Input bandwidth | 800 | kHz | |||
| DC ACCURACY | ||||||
| DNL | Differential nonlinearity | Resolution: 16 bits | –0.99 | 0.99 | LSB | |
| INL | Integral nonlinearity(3) | Resolution: 16 bits | –5 | ±1.5 | 5 | LSB |
| EO | Offset error | Initial, at 25°C | –50 | ±2.5 | 50 | µV |
| TCEO | Offset error thermal drift(1) | –1.3 | 1.3 | μV/°C | ||
| EG | Gain error | Initial, at 25°C | –0.3% | –0.02% | 0.3% | |
| TCEG | Gain error thermal drift(2) | –40 | ±20 | 40 | ppm/°C | |
| PSRR | Power-supply rejection ratio | VAVDD from 4.5 to 5.5V, at dc | 105 | dB | ||
| AC ACCURACY | ||||||
| SNR | Signal-to-noise ratio | fIN = 1 kHz | 76 | 81 | dB | |
| SINAD | Signal-to-noise + distortion | fIN = 1 kHz | 76 | 81 | dB | |
| THD | Total harmonic distortion | fIN = 1 kHz | –90 | –83 | dB | |
| SFDR | Spurious-free dynamic range | fIN = 1 kHz | 83 | 92 | dB | |
| DIGITAL INPUTS/OUTPUTS | ||||||
| External Clock | ||||||
| fCLKIN | Input clock frequency | 5 | 20 | 20.1 | MHz | |
| DutyCLKIN | Duty cycle | 5 MHz ≤ fCLKIN ≤ 20.1 MHz | 40% | 50% | 60% | |
| CMOS Logic Family, CMOS with Schmitt-Trigger | ||||||
| IIN | Input current | DGND ≤ VIN ≤ DVDD | –1 | 1 | μA | |
| CIN | Input capacitance | 5 | pF | |||
| VIH | High-level input voltage | 0.7 × DVDD | DVDD + 0.3 | V | ||
| VIL | Low-level input voltage | –0.3 | 0.3 × DVDD | V | ||
| CLOAD | Output load capacitance | fCLKIN = 20 MHz | 30 | pF | ||
| VOH | High-level output voltage | IOH = –20 µA | DVDD – 0.1 | V | ||
| IOH = –4 mA | DVDD – 0.4 | |||||
| VOL | Low-level output voltage | IOL = 20 µA | 0.1 | V | ||
| IOL = 4 mA | 0.4 | |||||
| POWER SUPPLY | ||||||
| AVDD | High-side supply voltage | 4.5 | 5.0 | 5.5 | V | |
| IAVDD | High-side supply current | 6.5 | 8.2 | mA | ||
| PAVDD | High-side power dissipation | 32.5 | 45.1 | mW | ||
| DVDD | Controller-side supply voltage | 3.0 | 3.3 | 5.5 | V | |
| IDVDD | Controller-side supply current | 3.0 V ≤ DVDD ≤ 3.6 V | 2.7 | 4.0 | mA | |
| 4.5 V ≤ DVDD ≤ 5.5 V | 3.2 | 5.5 | ||||
| PDVDD | Controller-side power dissipation | 3.0 V ≤ DVDD ≤ 3.6 V | 8.9 | 14.4 | mW | |
| 4.5 V ≤ DVDD ≤ 5.5 V | 16.0 | 30.3 | ||||
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| ANALOG INPUTS | ||||||
| VClipping | Maximum differential voltage input range (AINP-AINN) |
±312.5 | mV | |||
| FSR | Specified linear full-scale range (AINP-AINN) |
–250 | 250 | mV | ||
| VCM | Operating common-mode input range | –0.16 | AVDD – 2 | V | ||
| CID | Differential input capacitance | 1 | pF | |||
| IIB | Input current | Inputs shorted to AGND | –82 | –60 | –48 | μA |
| RID | Differential input resistance | 25 | kΩ | |||
| IOS | Input offset current | ±5 | nA | |||
| CMTI | Common-mode transient immunity | 15 | kV/μs | |||
| CMRR | Common-mode rejection ratio | fIN = 0 Hz, VCM min ≤ VIN ≤ VCM max |
–95 | dB | ||
| fIN from 0.1 Hz to 50 kHz, VCM min ≤ VIN ≤ VCM max |
–76 | |||||
| BW | Input bandwidth | 1000 | kHz | |||
| DC ACCURACY | ||||||
| DNL | Differential nonlinearity | Resolution: 16 bits | –0.99 | 0.99 | LSB | |
| INL | Integral nonlinearity(1) | Resolution: 16 bits | –4 | ±1.5 | 4 | LSB |
| EO | Offset error | Initial, at 25°C | –150 | ±40 | 150 | µV |
| TCEO | Offset error thermal drift(2) | –1.3 | 1.3 | μV/°C | ||
| EG | Gain error | Initial, at 25°C | –0.3 | –0.02 | 0.3 | %FS |
| TCEG | Gain error thermal drift(3) | –40 | ±20 | 40 | ppm/°C | |
| PSRR | Power-supply rejection ratio | VAVDD from 4.5 V to 5.5 V, at dc | 90 | dB | ||
| AC ACCURACY | ||||||
| SNR | Signal-to-noise ratio | fIN = 1 kHz | 82 | 85 | dB | |
| SINAD | Signal-to-noise + distortion | fIN = 1 kHz | 80 | 84 | dB | |
| THD | Total harmonic distortion | fIN = 1 kHz | –90 | –83 | dB | |
| SFDR | Spurious-free dynamic range | fIN = 1 kHz | 83 | 92 | dB | |
| DIGITAL INPUTS/OUTPUTS | ||||||
| External Clock | ||||||
| fCLKIN | Input clock frequency | 5 | 20 | 20.1 | MHz | |
| DutyCLKIN | Duty cycle | 5 MHz ≤ fCLKIN ≤ 20.1 MHz | 40% | 50% | 60% | |
| CMOS Logic Family (AMC1305M25-Q1), CMOS with Schmitt-Trigger | ||||||
| IIN | Input current | DGND ≤ VIN ≤ DVDD | –1 | 1 | μA | |
| CIN | Input capacitance | 5 | pF | |||
| VIH | High-level input voltage | 0.7 × DVDD | DVDD + 0.3 | V | ||
| VIL | Low-level input voltage | –0.3 | 0.3 × DVDD | V | ||
| CLOAD | Output load capacitance | fCLKIN = 20 MHz | 30 | pF | ||
| VOH | High-level output voltage | IOH = –20 µA | DVDD – 0.1 | V | ||
| IOH = –4 mA | DVDD – 0.4 | |||||
| VOL | Low-level output voltage | IOL = 20 µA | 0.1 | V | ||
| IOL = 4 mA | 0.4 | |||||
| LVDS Logic Family (AMC1305L25-Q1) | ||||||
| VOD | Differential output voltage | RLOAD = 100 Ω | 250 | 350 | 450 | mV |
| VOCM | Output common-mode voltage | 1.125 | 1.23 | 1.375 | V | |
| IS | Output short-circuit current | 24 | mA | |||
| VICM | Input common-mode voltage | VID = 100 mV | 0.05 | 1.25 | 3.25 | V |
| VID | Differential input voltage | 100 | 350 | 600 | mV | |
| IIN | Input current | DGND ≤ VIN ≤ 3.3 V | –24 | 0 | 20 | µA |
| POWER SUPPLY | ||||||
| AVDD | High-side supply voltage | 4.5 | 5.0 | 5.5 | V | |
| IAVDD | High-side supply current | 6.5 | 8.2 | mA | ||
| PAVDD | High-side power dissipation | 32.5 | 45.1 | mW | ||
| DVDD | Controller-side supply voltage | 3.0 | 3.3 | 5.5 | V | |
| IDVDD | Controller-side supply current | AMC1305L25-Q1, RLOAD = 100 Ω | 6.1 | 8.0 | mA | |
| AMC1305M25-Q1, 3.0 ≤ DVDD ≤ 3.6 V, CLOAD = 5 pF |
2.7 | 4.0 | ||||
| AMC1305M25-Q1, 4.5 ≤ DVDD ≤ 5.5 V, CLOAD = 5 pF |
3.2 | 5.5 | ||||
| PDVDD | Controller-side power dissipation | AMC1305L25-Q1, RLOAD = 100 Ω | 20.1 | 44.0 | mW | |
| AMC1305M25-Q1, 3.0 ≤ DVDD ≤ 3.6 V, CLOAD = 5 pF |
8.9 | 14.4 | ||||
| AMC1305M25-Q1, 4.5 ≤ DVDD ≤ 5.5 V, CLOAD = 5 pF |
16.0 | 30.3 | ||||
| PARAMETER | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|
| tCLK | CLKIN, CLKIN_N clock period | 49.75 | 50 | 200 | ns |
| tHIGH | CLKIN, CLKIN_N clock high time | 19.9 | 25 | 120 | ns |
| tLOW | CLKIN, CLKIN_N clock low time | 19.9 | 25 | 120 | ns |
| tD | Falling edge of CLKIN, CLKIN_N to DOUT, DOUT_N valid delay, CLOAD = 5 pF |
0 | 15 | ns | |
| tISTART | Interface startup time (DVDD at 3.0 V min to DOUT, DOUT_N valid with AVDD ≥ 4.5 V) |
32 | 32 | CLKIN cycles | |
| tASTART | Analog startup time (AVDD step up to 4.5 V with DVDD ≥ 3.0 V) | 1 | ms | ||
Figure 1. Digital Interface Timing
Figure 2. Digital Interface Startup Timing
| TA up to 150°C, stress voltage frequency = 60 Hz |
| AMC1305x25-Q1 |
| AMC1305x25-Q1 |
| AMC1305M05-Q1 |
| AMC1305M05-Q1 |
| AMC1305M05-Q1 |
| AMC1305x25-Q1, 4096-point FFT, VIN = 500 mVPP |
| AMC1305M05-Q1, 4096-point FFT, VIN = 500 mVPP |
| AMC1305M05-Q1 |
| AMC1305M05-Q1 |
| AMC1305x25-Q1 |
| AMC1305x25-Q1 |
| AMC1305x25-Q1 |
| AMC1305x25-Q1, 4096-point FFT, VIN = 500 mVPP |
| AMC1305M05-Q1, 4096-point FFT, VIN = 500 mVPP |