ZHCSG74B april 2017 – april 2023 AMC1301-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DWV (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 110.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 51.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 66.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 16.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 64.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |