SLPS382D January 2013 – August 2016 CSD97374Q4M
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DPC|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information
1 Features
- Over 92% System Efficiency at 15 A
- Max Rated Continuous Current 25 A, Peak 60 A
- High-Frequency Operation (up to 2 MHz)
- High-Density SON 3.5-mm x 4.5-mm Footprint
- Ultra-Low Inductance Package
- System Optimized PCB Footprint
- Ultra-Low Quiescent (ULQ) Current Mode
- 3.3-V and 5-V PWM Signal Compatible
- Diode Emulation Mode with FCCM
- Input Voltages up to 24 V
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Shoot-Through Protection
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
2 Applications
- Ultrabook/Notebook DC/DC Converters
- Multiphase Vcore and DDR Solutions
- Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems
3 Description
The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
Device Information(1)
| DEVICE | QTY | MEDIA | PACKAGE | SHIP |
|---|---|---|---|---|
| CSD97374Q4M | 2500 | 13-Inch Reel | SON 3.50-mm × 4.50-mm Plastic Package |
Tape and Reel |
- For all available packages, see the orderable addendum at the end of the data sheet.
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Application Diagram
Typical Power Stage Efficiency and Power Loss
