SLUSDV5B October 2019 – April 2020 UCC5304
PRODUCTION DATA.
| THERMAL METRIC(1) | DWV (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 108.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 32.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.6 | °C/W |