ZHCSHY0B March 2018 – June 2018 TS5USBC41
PRODUCTION DATA.
| THERMAL METRIC (1) | Device | UNIT | |
|---|---|---|---|
| YFF | |||
| 12 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 91.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 22.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 23.0 | °C/W |