ZHCS294G June 2011 – May 2024 TPA6211A1-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TPA6211A1-Q1 | UNIT | |
|---|---|---|---|
| DGN (HVSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 71.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 55.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 44.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 44.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 19.6 | °C/W |