ZHCSLO8E November 2020 – July 2024 TMUX6208 , TMUX6209
PRODUCTION DATA
| THERMAL METRIC(1) | TMUX620x | UNIT | ||
|---|---|---|---|---|
| PW (TSSOP) | RUM (WQFN) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 93.5 |
41.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 24.9 |
24.5 |
°C/W |
| RθJB | Junction-to-board thermal resistance | 40.0 |
16.1 |
°C/W |
| ΨJT | Junction-to-top characterization parameter | 1.0 |
0.2 |
°C/W |
| ΨJB | Junction-to-board characterization parameter | 39.4 |
16.1 |
°C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 2.8 |
°C/W |