ZHCSJ88C December 2018 – February 2024 TMUX1119
PRODUCTION DATA
| THERMAL METRIC(1) | TMUX1119 | UNIT | ||
|---|---|---|---|---|
| DCK (SC70) | DBV (SOT-23) | |||
| 6 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 243.1 | 212.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 206.0 | 156.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 128.3 | 96.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 107.8 | 80.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 128.0 | 96.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |