ZHCSJG7D March 2019 – February 2024 TMUX1101 , TMUX1102
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TMUX1101 / TMUX1102 | UNIT | ||
|---|---|---|---|---|
| DCK (SC70) | DBV (SOT-23) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 348.5 | 224.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 238.3 | 150.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 205.7 | 130.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 141.4 | 74.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 204.7 | 129.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |