ZHCSH80E September 2017 – May 2019 TMP235 , TMP236
PRODUCTION DATA.
| THERMAL METRIC (1)(2) | TMP235 | UNIT | ||
|---|---|---|---|---|
| DCK (SC70) | DBZ (SOT-23) | |||
| PINS | PINS | |||
| RθJA | Junction-to-ambient thermal resistance(3)(4) | 275 | 167 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 84 | 90 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56 | 146 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.2 | 35 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 55 | 146 | °C/W |