ZHCSFX0B November 2016 – August 2017 TLV2316-Q1 , TLV316-Q1 , TLV4316-Q1
PRODUCTION DATA.
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Supply voltage | 7 | V | |||
| Signal input pins | Voltage(2) | Common-mode | (V–) – 0.5 | (V+) + 0.5 | V |
| Differential | (V+) – (V–) + 0.2 | ||||
| Current(2) | –10 | 10 | mA | ||
| Output short-circuit(3) | Continuous | mA | |||
| Temperature | Specified, TA | –40 | 125 | °C | |
| Junction, TJ | 150 | ||||
| Storage, Tstg | –65 | 150 | |||
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±4000 | V |
| Charged-device model (CDM), per AEC Q100-011 | ±750 | |||
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| VS | Supply voltage | 1.8 | 5.5 | V | ||
| Specified temperature range | –40 | 125 | °C | |||
| THERMAL METRIC(1) | TLV316-Q1 | UNIT | |
|---|---|---|---|
| DBV (SOT-23) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 221.7 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 144.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 26.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 49.0 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | °C/W |
| THERMAL METRIC(1) | TLV2316-Q1 | UNIT | |
|---|---|---|---|
| DGK (VSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 186.6 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 78.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 107.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 106.3 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | °C/W |
| THERMAL METRIC(1) | TLV4316-Q1 | UNIT | |
|---|---|---|---|
| PW (TSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 117.8 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 46.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 5.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | °C/W |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| OFFSET VOLTAGE | |||||||
| VOS | Input offset voltage | VS = 5 V | ±0.75 | ±3 | mV | ||
| VS = 5 V, TA = –40°C to 125°C | ±4.5 | ||||||
| dVOS/dT | Drift | VS = 5 V, TA = –40°C to 125°C | ±2 | µV/°C | |||
| PSRR | Power-supply rejection ratio | VS = 1.8 V – 5.5 V, VCM = (V–) | ±30 | ±175 | µV/V | ||
| Channel separation, dc | At dc | 100 | dB | ||||
| INPUT VOLTAGE RANGE | |||||||
| VCM | Common-mode voltage range | VS = 5.5 V | (V–) – 0.2 | (V+) + 0.2 | V | ||
| CMRR | Common-mode rejection ratio | VS = 5.5 V, (V–) – 0.2 V < VCM < (V+) – 1.4 V, TA = –40°C to 125°C |
72 | 90 | dB | ||
| VS = 5.5 V, VCM = –0.2 V to 5.7 V, TA = –40°C to 125°C |
75 | ||||||
| INPUT BIAS CURRENT | |||||||
| IB | Input bias current | ±10 | pA | ||||
| IOS | Input offset current | ±10 | pA | ||||
| NOISE | |||||||
| En | Input voltage noise (peak-to-peak) | VS = 5 V, f = 0.1 Hz to 10 Hz | 5 | µVPP | |||
| en | Input voltage noise density | VS = 5 V, f = 1 kHz | 12 | nV/√Hz | |||
| in | Input current noise density | f = 1 kHz | 1.3 | fA/√Hz | |||
| INPUT IMPEDANCE | |||||||
| ZID | Differential | 2 || 2 | 1016Ω || pF | ||||
| ZIC | Common-mode | 2 || 4 | 1011Ω || pF | ||||
| OPEN-LOOP GAIN | |||||||
| AOL | Open-loop voltage gain | VS = 5.5 V, (V–) + 0.05 V < VO < (V+) – 0.05 V, RL = 10 kΩ |
100 | 104 | dB | ||
| VS = 5.5 V, (V–) + 0.15 V < VO < (V+) – 0.15 V, RL = 2 kΩ |
104 | ||||||
| FREQUENCY RESPONSE | |||||||
| GBP | Gain bandwidth product | VS = 5 V, G = 1 | 10 | MHz | |||
| φm | Phase margin | VS = 5 V, G = 1 | 60 | Degrees | |||
| SR | Slew rate | VS = 5 V, G = 1 | 6 | V/μs | |||
| tS | Settling time | To 0.1%, VS = 5 V, 2-V step , G = 1, CL = 100 pF | 1 | μs | |||
| tOR | Overload recovery time | VS = 5 V, VIN × gain = VS | 0.8 | μs | |||
| THD + N | Total harmonic distortion + noise(1) | VS = 5 V, VO = 0.5 VRMS, G = 1, f = 1 kHz | 0.008% | ||||
| OUTPUT | |||||||
| VO | Voltage output swing from supply rails | VS = 1.8 V to 5.5 V, RL = 10 kΩ | 35 | mV | |||
| VS = 1.8 to 5.5 V, RL = 2 kΩ | 125 | ||||||
| ISC | Short-circuit current | VS = 5 V | ±50 | mA | |||
| ZO | Open-loop output impedance | VS = 5 V, f = 10 MHz | 250 | Ω | |||
| POWER SUPPLY | |||||||
| VS | Specified voltage range | 1.8 | 5.5 | V | |||
| IQ | Quiescent current per amplifier | VS = 5 V, IO = 0 mA, TA = –40°C to 125°C | 400 | 575 | µA | ||
| TEMPERATURE | |||||||
| TA | Specified | –40 | 125 | °C | |||
| Tstg | Storage | –65 | 150 | °C | |||
| TITLE | FIGURE |
|---|---|
| Offset Voltage Production Distribution | Figure 1 |
| Offset Voltage vs Common-Mode Voltage | Figure 2 |
| Open- Loop Gain and Phase vs Frequency | Figure 3 |
| Input Bias and Offset Current vs Temperature | Figure 4 |
| Input Voltage Noise Spectral Density vs Frequency | Figure 5 |
| Quiescent Current vs Supply Voltage | Figure 6 |
| Small-Signal Overshoot vs Load Capacitance | Figure 7 |
| No Phase Reversal | Figure 8 |
| Small-Signal Step Response | Figure 9 |
| Large-Signal Step Response | Figure 10 |
| Short-Circuit Current vs Temperature | Figure 11 |
| Electromagnetic Interference Rejection Ratio Referred to Noninverting Input vs Frequency | Figure 12 |
| Channel Separation vs Frequency | Figure 13 |
| Distribution taken from 12551 amplifiers |
| VCM < (V+) – 1.4 V | ||
| V+ = 2.75 V, V– = –2.75 V, G = –1 V/V | ||
| V+ = 2.75 V, V– = –2.75 V, G = 1 V/V | ||
| V+ = 2.75 V, V– = –2.75 V | ||
| V+ = 2.75 V | V– = –2.75 V | 9 typical units shown |
| V+ = 2.75 V, V– = –2.75 V | ||
| V+ = 2.75 V, V– = –2.75 V, CL = 100 pF, G = 1 V/V | ||
| PRF = –10 dBm | ||