ZHCSGC4D March 2016 – April 2021 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1
PRODUCTION DATA
| Thermal Metric(1) | TEST CONDITIONS | TCAN1051-Q1 | |||
|---|---|---|---|---|---|
| D (SOIC) | DRB (VSON) | Unit | |||
| 8 Pins | 8 Pins | ||||
| RθJA | Junction-to-air thermal resistance | High-K thermal resistance | 105.8 | 40.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.8 | 49.7 | °C/W | |
| RθJC(TOP) | Junction-to-case (top) thermal resistance | 48.3 | 15.7 | °C/W | |
| ΨJT | Junction-to-top characterization parameter | 8.7 | 0.6 | °C/W | |
| ΨJB | Junction-to-board characterization parameter | 46.2 | 15.9 | °C/W | |
| TTSD | Thermal shutdown temperature | 170 | 170 | °C | |
| TTSD_HYS | Thermal shutdown hysteresis | 5 | 5 | °C | |