ZHCSJ41 December 2018 SN55HVD233-SEP
PRODUCTION DATA.
| THERMAL METRIC(2)(1) | SN55HVD233-SEP | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 112.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 57.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.2 | °C/W |