ZHCSGF0D July 2017 – October 2019 MCP6291 , MCP6292 , MCP6294
PRODUCTION DATA.
| THERMAL METRIC(1) | MCP6294 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 106.9 | 135.8 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 64 | 64 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63 | 79 | °C/W |
| ψJT | Junction-to-top characterization parameter | 25.9 | 15.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 62.7 | 78.4 | °C/W |