ZHCSKP5D june 2020 – april 2023 LMV321A-Q1 , LMV324A-Q1 , LMV358A-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LMV324A-Q1 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | DYY (SOT-23) | |||
| 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 115.1 | 135.3 | 154.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 71.2 | 63.5 | 86.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 71.1 | 78.4 | 67.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 29.6 | 13.6 | 10.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 70.7 | 77.9 | 67.5 | °C/W |