ZHCSL46E March   2020  – April 2022 LM62440-Q1

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Revision History
5. 5 說(shuō)明（續(xù)）
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1 Absolute Maximum Ratings
   2. 8.2 ESD Ratings
   3. 8.3 Recommended Operating Conditions
   4. 8.4 Thermal Information
   5. 8.5 Electrical Characteristics
   6. 8.6 Timing Characteristics
   7. 8.7 Systems Characteristics
   8. 8.8 Typical Characteristics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1  EN Uses for Enable and VIN UVLO
      2. 9.3.2  MODE/SYNC Pin Operation
         1. 9.3.2.1 Level-Dependent MODE/SYNC Pin Control
         2. 9.3.2.2 Pulse-Dependent MODE/SYNC Pin Control
         3. 9.3.2.3 Clock Locking
      3. 9.3.3  PGOOD Output Operation
      4. 9.3.4  Internal LDO, VCC UVLO, and BIAS Input
      5. 9.3.5  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
      6. 9.3.6  Adjustable SW Node Slew Rate
      7. 9.3.7  Spread Spectrum
      8. 9.3.8  Soft Start and Recovery From Dropout
      9. 9.3.9  Output Voltage Setting
      10. 9.3.10 Overcurrent and Short Circuit Protection
      11. 9.3.11 Thermal Shutdown
      12. 9.3.12 Input Supply Current
   4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Active Mode
         1. 9.4.3.1 CCM Mode
         2. 9.4.3.2 Auto Mode – Light-Load Operation
            1. 9.4.3.2.1 Diode Emulation
            2. 9.4.3.2.2 Frequency Reduction
         3. 9.4.3.3 FPWM Mode – Light-Load Operation
         4. 9.4.3.4 Minimum On-Time (High Input Voltage) Operation
         5. 9.4.3.5 Dropout
10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1  Choosing the Switching Frequency
          2. 10.2.2.2  Setting the Output Voltage
          3. 10.2.2.3  Inductor Selection
          4. 10.2.2.4  Output Capacitor Selection
          5. 10.2.2.5  Input Capacitor Selection
          6. 10.2.2.6  BOOT Capacitor
          7. 10.2.2.7  BOOT Resistor
          8. 10.2.2.8  VCC
          9. 10.2.2.9  BIAS
          10. 10.2.2.10 CFF and RFF Selection
          11. 10.2.2.11 External UVLO
       3. 10.2.3 Application Curves
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
       1. 12.1.1 Ground and Thermal Considerations
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Documentation Support
       1. 13.1.1 Related Documentation
    2. 13.2 接收文檔更新通知
    3. 13.3 支持資源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 術(shù)語(yǔ)表
14. 14Mechanical, Packaging, and Orderable Information