ZHCSRI1F August 1997 – April 2021 CD54HC04 , CD74HC04
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | CD74HC04 | UNIT | |||
|---|---|---|---|---|---|
| PW (TSSOP) | N (PDIP) | D (SOIC) | |||
| 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 151.7 | 69.3 | 133.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 79.4 | 57.4 | 89.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 94.7 | 49.0 | 89.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 25.2 | 37.4 | 45.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 94.1 | 48.8 | 89.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |