ZHCSOB7 August 2019 – June 2021 CD54HCT14 , CD74HCT14
PRODUCTION DATA
| THERMAL METRIC(1) | CD74HCT14 | UNIT | |||
|---|---|---|---|---|---|
| N (PDIP) | D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 62.9 | 95.5 | 119.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.7 | 49.9 | 42.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 42.7 | 51.7 | 64.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 30.3 | 12.8 | 4.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 42.4 | 51.3 | 63.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |