ZHCSKT0J November 1998 – August 2024 CD4066B
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | CD406x | UNIT | ||||
|---|---|---|---|---|---|---|
| N (PDIP) | D (SOIC) | NS (SO) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 93.7 | 109.7 | 112.4 | 101.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.5 | 69.4 | 70.4 | 44.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 68.0 | 67.9 | 76.4 | 68.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 50.3 | 25.8 | 28.9 | 3.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 67.3 | 67.1 | 75.4 | 67.6 | °C/W |